Products Introduction
◆ AdaptStar
9 Functional Slots
1024+ Digital Channels
Direct Mount
Standard Instruments
◆ AdaptStar H
5 Functional Slots
512 Digital Channels
Direct Mount
Standard Instruments
◆ AdaptStar Q
3 Functional Slots
256+ Digital Channels
Customized Cable Mount
Standard Instruments
◆ IntroStar
Open – Short tester
8192 O/S Channels
Automatic Learning & Program Generation
Bus Communication
Instrument Boards
The AdaptStar Integrated Circuit Testing Equipment series are designed to adapt to the complexity of high-performance testing of SOC and Analog devices. AdaptStar provides a flexible architecture, including independent backplanes, various application test instruments and VI resources. It can rival the best Digital or Analog testers with a floating architecture. No matter production testing, development, verification, or platform conversion from other ATE, users can easily complete the tasks with the built-in tools, archive the goal of OEE & COT optimization, and meet the technical and business targets.
AdaptStar Instrument
Application Scenarios
The AdaptStar Integrated Circuit Testing Equipment series is a new generation of high-end digital, logic, SoC, and MCU testing equipment. Its performance can fully meet the testing needs of mainstream application chips in the market, achieving full coverage of various application scenarios such as computers, wearable devices, communication networks, office automation, smart transportation, automotive electronics, household electrical appliances, industrial automation, etc.
Loadboard Product Introduction
In order to meet customers’ requirement, provide one-stop service and solutions, SandTek has developed the STEK Point Solution (PS) Team.
PS team mainly provides customized solutions with SandTek test equipment, including but not limited to PCB boards (such as ATE Loadboard solution, DUT board, Probecard, various adapter boards), customized small mechanism solutions, as well as consulting service and support.
Socket Product Introduction
◆ Key Features
Standard family design and best test performance
WLCSP, BGA, QFN, QFP multiple packages
≥ 0.35mm lead pitch
Excellent contact resistance and current capability
Optimized positioning frame design